Fortafix Chemical Setting Adhesive Cement - LQ/S6 |
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A Quartz based 2 part (filler/binder) water based chemical setting ceramic paste. LQ/S6 Chemical Setting Adhesive is ideal for bonding, assembling, sealing, jointing or repairing glass, ceramics, metals, quartz, steatite etc. Fortafix LQ/S6 Chemical Setting Adhesive possesses excellent adhesive, thermal, electrical and mechanical properties. Low Thermal Expansion/High Dielectric Strength. Maximum continuous working temperature is >1000° C. |
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Typically Used For |
Elements, Ovens, Heaters, Encapsulating Elements, Hot Plates, Potting, Resistors, Embedding. |
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Suitable For |
· Bonding - Yes
· Thin Films/Coating - Yes
· Thick Sections - Yes
· Potting/Encapsulation - Yes |
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Property |
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Value |
Major Constituent |
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Silicate Glass Binder, Inorganic Oxides |
Ready Mixed or 2 part |
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2 Part |
Dispensable |
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Yes |
Relative Viscosity |
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Mixes to a viscous paste |
Coverage Rate/Coating Thickness |
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Softening Temperature (°C): |
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1000°C |
Melting Temperature (°C): |
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1100°C |
Wet Density (g.cm-3): |
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2.06 |
Colour: |
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Cream/Off-white |
Compressive Strength: |
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Thermal Conductivity (W.m-1.K-1): |
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Thermal Expansion (x10-6C-1): |
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3-5 |
Dielectric Strength (KV.mm-1) @ RT: |
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Volume Resistivity (Ωcm) @ RT: |
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>10^7 |
pH: |
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13 |
Expansion on Setting %: |
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0 |
Shrinkage (Linear %): 150-500°C |
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Shrinkage (Volume %): 150-500°C |
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Hardness Moh’s Scale |
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Oxidation Resistance |
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Excellent |
Alkali Resistance |
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Good |
Acid Resistance |
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Excellent |
Cure Guide |
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Water based product - requires heat curing |
Shelf Life: |
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12 Months |
Packaging: |
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500g, 1kg or other to special order |
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Additional Information |
· Binder Solids - % by Weight: 38.54
· Wet Density - 2.06
· Theoretical Density - 2.78
· Mix Binder and Filler in ratio 2 pbw Filler: 1 pbw Binder. |
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Application |
· Mix Binder and Filler in ratio 2 pbw Filler: 1 pbw Binder. (See note below).
· IT IS ESSENTIAL THAT ALL SURFACES TO BE BONDED ARE FREE FROM OIL, DUST OR ANY FORM OF SURFACE COATING OR CONTAMINATION.
· Ensure that all surfaces to be bonded, sealed or insulated are degreased, clean and free from contamination.
· A light surface abrasion of the material to be bonded will increase the amount of surface available for adhesion and will give improved mechanical key.
· Apply the adhesive to all surfaces to be bonded
· Join and apply moderate pressure to ensure even anchorage and solid contact of the surfaces to be bonded, so that all surfaces are fully wetted.
· Secure the components and allow the adhesive to set and harden. |
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Curing |
The cement should be allowed to harden at a minimum air temperature of 20°C until the initial set has taken place. If heat curing is practicable the hardening process may be accelerated using the following schedules;
· Heat from 20 to 80°C @ 4°C per minute (15 minutes). Hold for 10-20 minutes
· Heat from 80 to 140°C @ 2°C per minute (30 minutes). Hold for 120-180 minutes
· Heat from 140 to 200°C @ 0.2°C per minute (300 minutes).
· Above 200°C raise temperature @ 1°C per minute to required temperature, allow to cool progressively. |
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