Fortafix High Temperature RTV Silicone - HT FLEXSEAL 350

A cartridge applied Silicone based Sealant designed for use where a flexible bond is required together with high temperature resistance. This adhesive gives excellent adhesion between most substrates and, because of its high elasticity, is particularly suited for gap-filling applications and jointing materials of different thermal expansion characteristics & where vibration is a problem. Wide operating temperature range up to 350°C

Typically Used For

·  Flexible Joints for Flues & Ducting
·  Electrical Insulation
·  Fixing Ceramic Rope
·  Gasketing
·  Joining Metals, Glass, Ceramics, Polymers

Suitable For

·  Bonding - Yes
·  Gasketing - Yes
·  Thick Sections - Yes
·  Potting/Encapsulation - Yes

Property

Value

Major Constituent

Ethyltriacetoxysilane

Ready Mixed or 2 part

Ready Mixed

Dispensable

Yes

Relative Viscosity

Non-slump paste

Coverage Rate/Coating Thickness

45m@3mm diam bead
100m@2mm diam bead

Softening Temperature (°C):

330°C

Melting Temperature (°C):

350°C

Wet Density (g.cm-3):

1.28

Colour:

Red

Compressive Strength:

Thermal Conductivity (W.m-1.K-1):

Thermal Expansion (x10-6C-1):

Dielectric Strength (KV.mm-1) @ RT:

Volume Resistivity (Ωcm) @ RT:

pH:

Expansion on Setting %:

Shrinkage (Linear %): 150-500°C

Shrinkage (Volume %): 150-500°C

Hardness Moh’s Scale

Oxidation Resistance

Alkali Resistance

Acid Resistance

Cure Guide

Humidity and temperature (See note below).

Shelf Life:

12 Months

Packaging:

300ml Euro Cartridge

Additional Information

Test data: DIN 53505 S3A
Tensile Strength: 1.4 N/mm2
Modulus @ 100% elongation: 0.6 N/mm2
Elongation at break: 420%
Shrinkage: 3%
·  Excellent adhesion to metals, glass, ceramics, polymers etc
·  Gap filling & resistant to many solvents
·  Provides a high temperature flexible joint for flues, ducting etc
·  Resistant to weathering and ageing - can be used externally
·  Wide operating temperature range up to 350°C

Application

IT IS ESSENTIAL THAT ALL SURFACES TO BE BONDED ARE FREE FROM OIL, DUST OR ANY FORM OF SURFACE COATING OR CONTAMINATION.
·  Ensure that all surfaces to be bonded, sealed or insulated are degreased, clean and free from contamination.
·  A light surface abrasion of the material to be bonded will increase the amount of surface available for adhesion and will give improved mechanical key.
·  Apply the adhesive to all surfaces to be bonded
·  Join and apply moderate pressure to ensure even anchorage and solid contact of the surfaces to be bonded, so that all surfaces are fully wetted.
·  Secure the components and allow the adhesive to set and harden.

Curing

Product requires humidity and temperature for cure.
·  Skin forming time @ 23°C/50%RH: 15 minutes
·  Cure Rate @ 25°C/60%RH: 3 mm per 24 hours