Fortafix High Temperature Sealant - T.C. Caulking Compound

A Cartridge applied water based Thixotropic Ceramic Sealing Compound designed for use where heat resistance is an important requirement. It possesses good tack and application properties and will resist the effects of heat to temperatures of 1250°C. T.C. Caulking Compound can be safely used as a fixing or jointing medium where resistance to the spread of flame or fire is a requirement.

Typically Used For

Fixing or joining ceramics, glass, metals, concrete, stone, silicate fibre materials and many other surfaces. Fire protection applications.

Suitable For

·  Thin films/Coating - Yes
·  Bonding - Yes
·  Encapsulation - No
·  Thick Sections - No

Property

Value

Major Constituent

Alkali Silicate Glass, Inorganic Oxides

Ready Mixed or 2 part

Ready Mixed

Dispensable

Yes

Relative Viscosity

Viscous Paste - Thixotropic

Coverage Rate/Coating Thickness

45 m @ 3 mm diam bead
100m @ 2 mm diam bead

Softening Temperature (°C):

1200°C

Melting Temperature (°C):

1300°C

Wet Density (g.cm-3):

Colour:

White or Black

Compressive Strength:

Thermal Conductivity (W.m-1.K-1):

Thermal Expansion (x10-6C-1):

Dielectric Strength (KV.mm-1) @ RT:

Volume Resistivity (Ωcm) @ RT:

pH:

13

Expansion on Setting %:

0

Shrinkage (Linear %): 150-500°C

Shrinkage (Volume %): 150-500°C

Hardness Moh’s Scale

Oxidation Resistance

Excellent

Alkali Resistance

Can be re-dissolved at high pH & temperature

Acid Resistance

Excellent - except hydrofluoric

Cure Guide

Water based product - requires heat curing.

Shelf Life:

12 Months

Packaging:

300ml Euro Cartridge, 250ml, 1l, 5l lever lid metal cans.

Additional Information

·  This ready-mixed Sealing Compound is water based, and does not contain hydrocarbon resins or solvents.
·  Economical in cost and application
·  Withstands temperatures up to 1250°C - Strong adhesive properties at all temperatures.
·  It is used successfully with ceramics, glass, metals, concrete, stone, silicate fibre materials and many other surfaces, either to themselves or to each other. It has good joint and gap-filling properties and will resist the attack of organic solvents, oils, mould, fungi and acids.
·  Sets to a hard and rigid ceramic mass which should not deteriorate under thermal shock, or age, under normal conditions. Hardens by air drying and operational heat which improves and strengthens seals and joints.
·  Water resistance will be improved by the application of heat.

Application

IT IS ESSENTIAL THAT ALL SURFACES TO BE BONDED ARE FREE FROM OIL, DUST OR ANY FORM OF SURFACE COATING OR CONTAMINATION.
·  For product supplied in canisters - Stir contents of the container prior to use, to overcome the effects of any settlement of the ingredients during storage.
·  Ensure that all surfaces to be bonded sealed or insulated, are degreased, clean and free from contamination.
·  A light surface abrasion of the material to be bonded will increase the amount of surface area available for adhesion and will give improved mechanical key.
·  Apply the adhesive to all surfaces to be bonded.
·  Join and apply moderate pressure to ensure even anchorage and solid contact of the surfaces to be bonded, ensure that all surface are fully wetted by the adhesive.
·  Secure the components and allow the adhesive to set and harden.

Curing

This product is water based. In order to cure of the material it is necessary to fully dry & dehydrate the adhesive, by heating as gently & progressively as time and circumstances will allow. The ease by which full curing can be achieved is dependent on the porosity of the substrate, as well as the amount of available surface through which the adhesive film can dry. The cement should be allowed to harden at a minimum air temperature of 20°C until initial set has taken place. After this period the hardening process may be accelerated using the following typical schedule;
·  Heat from 20° to 80°C @ 4°C per minute (15 minutes). Hold for 10-20 minutes
·  Heat from 80° to 140°C @ 2°C per minute (30 minutes). Hold for 120-180 minutes
·  Heat from 140° to 200°C @ 0.2°C per minute (300 minutes).
·  Above 200°C - raise temperature @ 1°C per minute to required temperature, allow to cool progressively. Hardening and curing times given are approximate in view of possible variations in adhesive volume, glue line thickness, and substrate conditions, all of which will influence curing times.