Appointed retail & small lot distributors
Heatflo Sealants

Autostic FS Series - High Temperature Adhesive Products

Autostic is a single pack high temperature resisting adhesive/cement/sealant, suitable for a wide range of jointing, coating and sealing applications. Autostic is ideal for bonding, assembling, sealing, jointing or repairing glass, ceramics, metals, quartz, steatite etc. It can be applied by spray, cartridge or trowel. Maximum continuous working temperature is >+1000°C
·  FC4 for use with spray or dipping application
·  FC6 for use with brush or spreader
·  FC8 for use with trowel or cartridge gun application
·  FC9 for cartridge gun application
·  FS is a faster curing product than the FC Series and is therefore more appropriate for bonding applications where less absorbent substrates are present. (Only available in cartridge form, Viscosity approx. 2000 MPa).

Typically Used For

·  Elements
·  Fire Doors
·  Glazing Bars
·  Heaters
·  Hot Plates
·  Resistors
·  Ovens
·  Thermocouples

Suitable For

·  Thin films/Coating - Yes
·  Bonding - Yes
·  Encapsulation - No
·  Thick Sections - No

Property

Value

Major Constituent

Alkali Silicate Glass, Inorganic Oxides

Ready Mixed or 2 part

Ready Mixed

Dispensable

Yes

Relative Viscosity

FCS 2000 mPas

Coverage Rate/Coating Thickness

 

Softening Temperature (°C):

1000°C

Melting Temperature (°C):

1100°C

Wet Density (g.cm-3):

2.08

Colour:

White

Compressive Strength:

28.4 MPa

Thermal Conductivity (W.m-1.K-1):

0.5-1.0

Thermal Expansion (x10-6C-1):

18-20

Dielectric Strength (KV.mm-1) @ RT:

400

Volume Resistivity (Ωcm) @ RT:

>10^9

pH:

13

Expansion on Setting %:

0

Shrinkage (Linear %): 150-500°C

1.5

Shrinkage (Volume %): 150-500°C

 

Hardness Moh’s Scale

 

Oxidation Resistance

Excellent

Alkali Resistance

Can be re-dissolved at high pH & temperature

Acid Resistance

Excellent - except hydrofluoric

Cure Guide

Water based - requires heat curing. (See Below).

Shelf Life:

12 Months

Packaging:

FC4 FC6 FC8: 500g tin, 3kg tin. FC9: 300ml cartridge.

Additional Information

Tensile Strength (between steel plates): 1.7 MPa
Max. Tensile Stress (bending test): 7.1 MPa
Shear Strength: 3.15 MPa
Hardness: VPN 6 (1 kg load)
Dielectric Constant: 41.2

Application

IT IS ESSENTIAL THAT ALL SURFACES TO BE BONDED ARE FREE FROM OIL, DUST OR ANY FORM OF SURFACE COATING OR CONTAMINATION.
·  Stir contents of the container prior to use, to overcome the effects of any settlement of the ingredients during storage.
·  Ensure that all surfaces to be bonded sealed or insulated, are degreased, clean and free from contamination.
·  A light surface abrasion of the material to be bonded will increase the amount of surface area available for adhesion and will give improved mechanical key.
·  Apply the adhesive to all surfaces to be bonded.
·  Join and apply moderate pressure to ensure even anchorage and solid contact of the surfaces to be bonded, ensure that all surface are fully wetted by the adhesive.
·  Secure the components and allow the adhesive to set and harden.

Curing

This product is water based. In order to cure of the material it is necessary to fully dry & dehydrate the adhesive, by heating as gently & progressively as time and circumstances will allow. The ease by which full curing can be achieved is dependant on the porosity of the substrate, as well as the amount of available surface through which the adhesive film can dry.
The cement should be allowed to harden at a minimum air temperature of 20°C until initial set has taken place. After this period the hardening process may be accelerated using the following typical schedule;
·  Heat from 20° to 80°C @ 4°C per minute (15 minutes). Hold for 10-20 minutes
·  Heat from 80° to 140°C @ 2°C per minute (30 minutes). Hold for 120-180 minutes
·  Heat from 140° to 200°C @ 0.2°C per minute (300 minutes).
·  Above 200°C - raise temperature @ 1°C per minute to required temperature, allow to cool progressively.
Hardening and curing times given are approximate in view of possible variations in adhesive volume, glue line thickness, and substrate conditions, all of which will influence curing times.